微电子学院
School of Microelectronics
西北工业大学微电子学院成立于2015年12月，是国家重点支持建设的示范性微电子学院，目前坐落于历史文化古城陕西西安，同时在江南水乡江苏太仓设有集成电路与智能系统国际联合研究中心。学院拥有“集成电路技术国家地方联合工程研究中心”，是全国15个“国家集成电路人才培养基地”之一，是教育部质量工程建设项目“微电子特色专业建设点”，是陕西省“工程型集成电路设计人才培养创新试验区”。学院设有微纳电子系、集成电路系、智能系统系和交叉应用研究中心，设有微电子科学与工程本科专业，具有电子科学与技术一级学科博士点，可在电路与系统、物理电子学、微电子学与固体电子学、航空电子综合技术、电子信息（集成电路工程、电子与通信工程）等学科方向招收硕士和博士研究生。
Founded in December 2015, the school of microelectronics of Northwest University of technology is a national key demonstration microelectronics college. At present, it is located in Xi'an, Shaanxi, an ancient historical and cultural city. At the same time, it has an international joint research center for integrated circuits and intelligent systems in Taicang, Jiangsu, a water town in the south of the Yangtze River. The college has "national local joint engineering research center of integrated circuit technology", is one of the 15 "national integrated circuit talent training bases" in China, is the "construction point of microelectronics specialty" of the quality engineering construction project of the Ministry of education, and is the "innovative experimental area for engineering integrated circuit design talent training" of Shaanxi Province. The college has the Department of micro and Nano Electronics, the Department of integrated circuits, the Department of intelligent systems and the cross application research center. It has a bachelor's degree in microelectronics science and engineering and a doctoral degree in Electronic Science and technology. It can be engaged in circuit and system, physical electronics, microelectronics and solid-state electronics, integrated avionics technology and electronic information (integrated circuit engineering, electronics and Communication Engineering) And other disciplines to recruit master's and doctoral students.
附件 Attachment：
Supervisor List for 2022 PhD Application School of Microelectronics.xlsx
重要提示 Notice:
1. 附件为微电子学院2022年专业信息表与可接收博士的导师信息表。
The attachments are the Major List and the Spervisor List that can accept the PhD students of the School of Microelectronics in 2022 Academic Year.
2. 请根据此表中导师的教师主页信息以及研究方向选择并联系与你研究方向一致或相似的导师，请不要群发邮件。
Please contact the supervisor according to the their researsh direction and Teacher Website Page information.
Do not send the MASS EMAIL.
3. 导师的邮箱域名为：@nwpu.edu.cn.
Please add: @nwpu.edu.cn after the email adress.
微电子学院博士专业介绍
The PhD Major Introduction for the School of Microelectronics
一、专业名称 Major： 电子科学与技术 Electronic Science and Technology
1.专业核心课程名称 Core Courses:
材料的电子显微学 Electron microscopy of materials
电磁理论中的渐近方法 Asymptotic method in electromagnetic theory
智能信息处理 intelligent information processing
信息融合理论 Information fusion theory
模糊控制与智能控制基础 Fundamentals of fuzzy control and intelligent control
光学原理 Optical principle
集成电路分析与设计 Integrated circuit analysis and design
微传感器原理和应用 Principle and application of micro sensor
雷达数据处理技术 Radar data processing technology
Advanced Antenna Theory
抗辐射集成电路设计 Design of Radiation-Hardened Integrated Circuits
2. 研究方向及介绍 Research Direction and its introduction:
① 自旋电子科学与技术 Spintronic Science and Technology
自旋电子科学利用电子的自旋和磁矩，使固体器件中除电荷输运外，还加入电子的自旋和磁矩。是一门新兴的学科和技术。应用于自旋电子学的材料，需要具有较高的电子极化率，以及较长的电子自旋弛豫时间。许多新材料，例如磁性半导体、半金属等，近年来被广泛的研究，以求能有符合自旋电子元件应用所需要的性质。
Spintronic science uses the spin and magnetic moment of electrons to add the spin and magnetic moment of electrons to solid-state devices in addition to charge transport. It is a new subject and technology. Materials used in spintronics should have higher electron polarizability and longer electron spin relaxation time. Many new materials, such as magnetic semiconductors and semi metals, have been widely studied in recent years in order to obtain the nature required for spintronic devices'application.
③ 集成电路设计 Integrated Circuit Design
集成电路设计是指以集成电路、超大规模集成电路为目标的设计流程。集成电路设计涉及对电子器件（例如晶体管、电阻器、电容器等）、器件间互连线模型的建立。所有的器件和互连线都需安置在一块半导体衬底材料之上，这些组件通过半导体器件制造工艺（例如光刻等）安置在单一的硅衬底上，从而形成电路。
Integrated circuit design refers to the design process aiming at integrated circuits and VLSI. Integrated circuit design involves the establishment of interconnection models of electronic devices (such as transistors, resistors, capacitors, etc.) and devices. All devices and interconnects need to be placed on a semiconductor substrate material. These components are placed on a single silicon substrate through semiconductor device manufacturing process (such as lithography, etc.) to form a circuit.
③ 集成于光电子芯片的高性能光电探测器 High-performance photodetector for photonic integrated circuits
光电探测器通过将光携带的信息转换为电信号来工作，并被广泛用于从游戏机到光纤通信、医学成像和运动探测器等应用领域中。当前，光电探测器无法在一种设备中感测一种以上的颜色，而且携带往往不方便。集成于光电子芯片的高性能光电探测器为改善生物医学成像打开了大门，促进了对癌症等健康问题的早期发现。除了缩小的医学成像设备外，超薄原型还为更有效的运动检测器、低光成像和可能更快的光纤通信打开了可能性。
Photodetectors work by converting the information carried by light into electrical signals, and are widely used in applications from game consoles to optical fiber communication, medical imaging and motion detectors. At present, photodetectors cannot sense more than one color in one device, and it is often inconvenient to carry. High performance photodetectors integrated into optoelectronic chips open the door to improve biomedical imaging and promote the early detection of health problems such as cancer. In addition to the reduced medical imaging equipment, the ultra-thin prototype also opens the possibility for more effective motion detectors, low light imaging and possibly faster optical fiber communication.
④ 射频电路设计 RF Circurts Design
射频电路一般由接收机射频处理单元、发射机射频处理单元和频率合成单元组成。射频电路的最大特点是在射频频段内，导线的电阻、电感或电容的特性都会变得相当复杂，有时完全丧失其原有特性。在射频频段内电阻可以表现出电感和电容的特性。发送系统硬件电路系统而言，最困难的部分就在于中放变频和RF功放。中放变频难点主要在于变频系统方案的设计，好的系统方案设计产生的相关干扰较少，甚至还可能降低对参与变频的本地振荡信号的要求。RF功放难点主要在于功率效率和线性度。
RF circuit is generally composed of receiver RF processing unit, transmitter RF processing unit and frequency synthesis unit. The biggest characteristic of RF circuit is that in the RF frequency band, the characteristics of conductor resistance, inductance or capacitance will become quite complex, and sometimes completely lose their original characteristics. In the RF frequency band, the resistance can show the characteristics of inductance and capacitance. For the hardware circuit system of the transmission system, the most difficult part is the intermediate amplifier frequency conversion and RF power amplifier. The difficulty of intermediate amplifier frequency conversion mainly lies in the design of frequency conversion system scheme. A good system scheme design produces less relevant interference, and may even reduce the requirements for local oscillation signals participating in frequency conversion. The difficulty of RF power amplifier mainly lies in power efficiency and linearity.
